LM4766T DATASHEET PDF
LMT/NOPB Texas Instruments Audio Amplifiers Overture Audio Pwr Amp Series Dual 40W datasheet, inventory, & pricing. LMT Texas Instruments Audio Amplifiers datasheet, inventory, & pricing. LMT LM – Overture Audio Power Amplifier Series Dual Watt Audio Power Amplifier With Mute, Package: to , Pin Nb=15 LM OvertureTM.
|Published (Last):||1 July 2004|
|PDF File Size:||11.17 Mb|
|ePub File Size:||2.47 Mb|
|Price:||Free* [*Free Regsitration Required]|
Refer to the graphs of Power Dissipation versus. The LM is protected from instantaneous peak. Special Audio Amplifier Application Circuit 5 www.
It starts operating again when the die temperature. The waveform to the right of the SOA graph exemplifies how the dynamic pro- tection will cause waveform distortion when enabled. Equation 1 exemplifies the theoretical maximum power dis- sipation point of each amplifier where V CC is the total supply voltage. Operating graph in the Typical Performance Characteris.
This greatly reduces the stress imposed on the IC by. These instabilities can be eliminated through multiple. The thermal resistance from the datxsheet junction to the outside.
Please refer to AN for more detailed information. Special Audio Amplifier Application Circuit. The choice of a heat sink for a high-power audio amplifier is. Typical Audio Amplifier Application Circuit. Taking into account supply line fluc- tuations, it is a good idea to pull out 1 mA per mute pin or 2 mA total if both pins are tied together.
Auxiliary Amplifier Application Circuit. The clamping effect is quite the same. Thus by knowing the total supply voltage and rated output load, the maximum power dissipation point can be calcu- lated. Numbers in parentheses represent pinout for amplifier B. The LM has excellent power supply rejection and does.
LMT Datasheet(PDF) – National Semiconductor (TI)
Since convection heat flow power dissipation is analogous to current flow, thermal resistance is analogous to electrical resistance, and tem- perature drops are analogous to voltage drops, the power dissipation out of the LM is equal to the following: Equation 1 exemplifies the theoretical maximum power dis.
Each amplifier within the LM has an independent. The LM has a sophisticated thermal protection scheme. Once the maximum package power dissipation has been.
Single Supply Application Circuit. Output Power in the Typical Performance Characteristics. Single Supply Amplifier Application Circuit.
PDF LM4766T Datasheet ( Hoja de datos )
The clamping effect is quite the same, however, the output transistors are designed to work alter- nately by sinking large current spikes. Using the best heat sink possible within the cost and. LM should have its supply leads bypassed with. Power dissipation within the integrated circuit package is a. Using the best heat sink possible within the cost datasbeet space constraints of the system will improve the long-term reliability of any power semiconductor device, as discussed in the Determining the Correct Heat Sink Section.
However, to improve system.
The package dissipation is twice the number which re. SPiKe Protection means that these. Upon system power-up, the under-voltage protection cir. However, to improve system performance as well as eliminate possible oscillations, the LM should have its supply leads bypassed with low-inductance capacitors having short leads that are lo- cated close to the package terminals.
SPiKe Protection Circuitry is not enabled. Thus by knowing the total supply voltage and rated output. Taking into account supply line fluc. The LM is a stereo audio amplifier capable of delivering.
Refer to the graphs of Power Dissipation versus Output Power in datashee Typical Performance Characteristics section which show the actual full range of power dissipation not just the dagasheet theoretical point that results from Equation 1. An incorrect maximum power dissipation calculation may result in inad- equate heat sinking causing thermal shutdown and thus lim- iting the output power.
This calculation is made using Equation 3. The LM contains over-voltage protection circuitry that. The package dissipation is twice the number which re- sults from Equation 1 since there are two amplifiers in each LM Upon turn-off, the output of the LM is brought to ground be- fore the power supplies datasehet that no transients occur at power-down. This greatly reduces the stress imposed on the IC by thermal cycling, which in turn improves its reliability under sustained fault conditions.
Since the die temperature is directly dependent upon the heat sink used, the heat sink should be chosen such that thermal shutdown will not be reached during normal opera- tion.
SPiKe Protection means that these parts are safeguarded at the output against overvoltage, un- dervoltage, overloads, including thermal runaway and in- stantaneous temperature peaks. Since the die temperature dataaheet directly dependent upon the.